China Develops Domestic DUV Lithography Machine, Capable of Producing 8nm and Below Chips Amid U.S. Tech Blockade

In response to tightening U.S. and Dutch semiconductor equipment export controls, China has announced it has developed a domestic deep ultraviolet (DUV) lithography machine capable of producing 8nm and smaller chips. This breakthrough could reduce China’s reliance on imported equipment and represents a strategic advance in the context of ongoing U.S.-China tech tensions. The announcement was made by China’s Ministry of Industry and Information Technology and aims to strengthen local industry through coordinated support policies. The domestic DUV lithography machine, while still a few generations behind the advanced machines made by Dutch company ASML, fills an important technological gap. ASML currently holds a monopoly on extreme ultraviolet (EUV) lithography machines, which are crucial for making smaller and more powerful chips. Recent moves by the U.S. and the Netherlands to restrict the export of advanced semiconductor machinery to China aim to curb China’s ability to produce high-tech chips independently. However, the development of a domestic DUV machine may allow China to manufacture a majority of chips without ASML’s equipment. Although China has not officially announced the commercial adoption of this machine by manufacturers, this development signifies a step toward overcoming technological blockades. In parallel developments, Chinese tech giant Huawei has released a new foldable smartphone, the Mate XT, indicating ongoing efforts to challenge Western tech dominance.