SK Hynix May Add Intel as HBM4E Base Die Supplier

SK Hynix is reportedly evaluating Intel Foundry as a second supplier for the base die used in its seventh-generation HBM4E memory, alongside TSMC. If adopted during mass production, the move would end TSMC’s reported sole-supplier position for SK Hynix’s HBM base die and reshape the AI memory supply chain. The base die is the logic chip at the bottom of an HBM stack. It controls the DRAM core dies and manages high-speed connections with GPUs and CPUs. Since HBM4, SK Hynix has outsourced production to TSMC using a 12-nanometre-class process. Industry sources estimate that an HBM4 base die made by TSMC costs three to four times more than SK Hynix’s internally produced 1b-class 10-nanometre DRAM core die. HBM4E is expected to require a more complex and expensive base die. Long-term supply agreements limit SK Hynix’s ability to pass higher foundry costs to customers, making Intel a potential solution for cost control, supply resilience and stronger negotiating leverage. The plan could also support the growth of custom HBM for AI chipmakers including NVIDIA, Google and Amazon. SK Hynix is separately assessing advanced packaging technologies such as TSMC’s CoWoS-S and CoWoS-L and Intel’s EMIB. Neither SK Hynix nor Intel has confirmed the reported HBM4E base die partnership. The development highlights growing competition among TSMC, Intel and Samsung in AI memory manufacturing.